http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 1 1 scope this specification shall cover the characteristics of the ceramic fliter with the type ltcv10.7ms3. th e ltcv10.7ms3 filters are small, high performance and very thin (1.5 mm) chip devices consisting of 2 ceramic elements for communication equipment. they are designed on mgtio3 ceramic cap package. 2 part no. part number customer part no. specification no. ltcv10.7ms3 3 outline drawing and structure 3.1 appearance no visible damage and dirt. 3.2 dimensions :input :ground :output unit:mm 2 3 2 3 2 3 3 3 7. 1 s3 range of frequency ? 3. 0.3
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 2 3.3 structure 4 electrical specifications 4.1 rating items content withstanding voltage (v) 50 (dc 1min) insulation resistance ri, m ? min. 100 100v 1min operating temperature range ( ) -25 +85 storage temperature range ( ) -40 +85 4.2 electrical specifications items content center frequency(fo)(mhz) the center point of 3db band width is defined as the center frequency and identified by the letters:a,b,c,d or e. a:10.7000.030 b:10.6700.030 c:10.7300.030 d:10.6400.030 e:10.7600.030 3db bandwidth(khz) 180 40 20db bandwidth(khz) max 470 insertion loss (db) 4.0 2.0 (at minimum loss point) ripple (db) max 1.0 (within 3db bandwidth) spurious response (db) min 35 (9mhz-12mhz) input/output impedance( ? ) 330 oscillation electrode cermic cover glue cermic substrate o utput/input electrode
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 3 5 test 5.1 test conditions parts shall be tested under a condition (temperature:+20 15 humidity:65%20%r.h.)unless the standard condition(temperature:+25 3 ,humidity:65%5% r.h.) is regulated to test. 5.2 test circuit: 6 physical and environmental characteristics no. item condition of test performance requirment 6.1 low temp stora g e stored in -40 3 for 96h and left at room temp. for 1h before measurement. meet table 1 6.2 high temp storage stored in 85 2 for 96h and left at room temp. for 1h before measurement. meet table 1 6.3 humidity stored at 40 2 in 90% 95%r.h. for 96h, and left at room temp. for 1h before measurement meet table 1 6.4 thermal shock after temp. cycling of -40 (30 m inutes) to +85 (30min) was performed 5 times, filter shall be measured after being placed in natural condition for 1h. meet table 1 6.5 soldering test passed through the reflow oven under the following condition for 2 times, and left at room temp. for 24h b efore measurement. meet table 1 6.6 solderability dipped in 235 5 solder bath for 3s 0.5s with rosin flux. the terminals shall be at least 95% covered by solder temp. at the surface of the substrate time preheat 150 5 60s 10s peak 235 5 10s 3s c2 r2 s.s.g. rg 2 1 3 rf voltmeter r1=280 ? 5%,r2=330 ? 5%,rg=50 ? c2=10 pf (including stray capacitance and capacitance of rf voltmeter) s.s.g:output voltmeter :input :ground :output
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 4 6.7 drop test free drop to the wood plate from the height of 70 cm for 3 times. meet table 1 6.8 vibration apply the vibration of sweep frequency 10 to 55hz/minutes, amplitude 1.5mm, duration 2h in each direction of 3 planes. meet table 1 6.9 board bending mount on a glass-epoxy board( width=50 mm, thickness=1.6mm),then bend it to 1mm displacement(velocity 1mm/sec) and keep it for 5s. mechanical damage such as break shall not occur table 1 specification after test about characteristics item specification after test insertion loss drift (db) max 2 3db bandwidth drift (khz) max 25 20db bandwidth drift (khz) max 60 note the limits in the above table are refe renced to the initi al measurements. 7 recommended land pattern and reflow soldering standard conditions 7.1recommended land pattern 2.9 0.3 2.9 0.3 1.5 0.3 1.5 0.3 1.5 0.3 4.0 0.3 r 1 0 20 45 2 45 2 1.0 0.2 support bar press press head d.u.t 5
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 5 7.2recommended reflow sold ering standard conditions within 10 sec 220~230 within 80-120sec. within 20-40sec pre-heating temperature( ) 100 150 200 8 package to protect the products in storage and transportation it is necessary to pack them outer and inner package .on paper pack, the following requirements are requested. dimensions and mark at the end of package, the warning (moisture proof, upward put) should be stick to it. dimensions and mark (see below)
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 6 section of package package is made of corruga ted paper with thickness of 0.8cm.package has 10 inner boxes, each box has 1 reels, every reel is vacuum packed for plastic bag (at 300 torr of vacuum rate). quantity of package per plastic reel 4000 pieces of piezoelectric ceramic part per inner box 1 reels per package 10 inner boxes 40000 pieces of piezoelectric ceramic part inner packing dimensions 1 label 2 qc label 3 inner box no. name quantity notes 1 package 1 2 certificate of approval 1 3 label 1 4 tying 2 5 adhesive tape 1.2m 6 belt 2.9m 7 inner box 10 1.unit: mm
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 7 pars shall be packaged in box w ith hold down tape upside. part no., quantity and lot no. 8.5reel 120 2 1 0 . 8 2.0 0.5 13.0 0.5 ( 330 3) 22.4max. (unit: mm) 16.4min 8.6taping dimensions 8.7tape characteristics feeding direction end blank pocket 10 pitches ...... loaded pocket blank pocket 10 pitches ...... 150~200mm lead tape 1.75 0.1 1.5 0 8.0 0.1 +0.1 chip filter 1.5 0 4.0 0.1 2.0 0.1 7.5 0.1 3.5 0.1 (unit:mm) 16.0 0.2 7.5 0.1
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 8 8.8test condition of peeling strength p e e l i n g s t r e n g t h 2 0 - 7 0 g c arrier t ape top tape 10 max 9 other 9.1 caution of use 9.1.1 do not use this product w ith bend. please don?t apply excess mechanical stress to the compone nt and terminals at soldering. 9.1.2 the component may be damage d when an excess stress will be applied. 9.1.3 this specification mentions the quality of the component as a single unit. please insure the compone nt is thoroughly evaluated in your application circuit. 9.2 notice 9.2.1 please return one of this specification after your signature of acceptance. 9.2.2 when something gets doubtful w ith this specifications, we shall jointly work to get an agreement.
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